Alex Katouzian, senior vice president and general manager, mobile, Qualcomm Technologies unveiled the new Qualcomm® 3D Sonic Fingerprint Technology.
The 3D Sonic Max is the latest version of its ultrasonic fingerprint sensor. It offers a recognition area that is 17x larger than the previous generation.
It ensures better security via a simultaneous two-finger authentication. Its speed and ease of use are also better.
3D Sonic Max
Qualcomm’s latest fingerprint sensor measures 20 mm x 30 mm with a sensing area of 600 square millimeters. It is only 0.15 mm thick and does not take up much space. Further applications of this ultrasonic fingerprint sensor include the authentication of sensitive information applications such as banking and work mail. Due to the larger surface area, the system can read two fingerprints at the same time. Unlike the previous generation, the 3D Sonic Max sensor’s fingerprint data is processed directly by the hardware without the need for additional algorithms.
Qualcomm also announced mobile two chips which include the flagship Snapdragon 865 which includes the Snapdragon X55 Modem-RF System and the Snapdragon 765/765G which brings integrated 5G connectivity, AI processing and select Qualcomm® Snapdragon Elite Gaming™ experiences.