The first phone with a Snapdragon 888 chipset is already official with the launch of Xiaomi’s Mi 11 yesterday in China. The brand new Xiaomi flagship has quickly made its way to local tech bloggers and teardown experts Aiao Technology decided to take it apart and show us what it looks like on the inside.
As with all teardowns this one starts by removing the SIM tray located on the bottom near the USB-C port. Then it’s time to pry open the plastic eco-leather back free from all the adhesive and remove a few screws holding the camera sensor cover. The main 108MP sensor is Samsung’s ISOCELL HMX which comes with OIS, it’s paired alongside a 5MP Samsung S5K5E9 while the 13MP ultrawide module is OmniVision’s CMOS OV13B10.
Xiaomi Mi 11 teardown (credit: Aiao Technology)
The motherboard is covered in plenty of copper foil on the front and back and also has several heat sinks for improved thermal performance. After removing the copper bits, we can actually see the brand new Snapdragon 888 chipset alongside the flash memory and both are sealed tight adhesive in case of any exposure to liquids. The 4,600 mAh battery comes courtesy of Sunwoda Electronics Co Ltd.